I/O Circuit Design for Multi-Chip Systems

Design and Benchmark (DB) or Component Packaging (CP)

This position focuses on the design of IO circuits — particularly logical PHY for die-to-die (D2D) interconnects — that form...

VCT based Oxide DRAM

Technology Development (TD), Memory

The Memory Team focuses on oxide-semiconductor-based 2T0C DRAM, pursuing an integrated research framework that spans device architecture, fabrication processes, materials,...

Agent AI for Semiconductor System

개별연구 학생 (Undergraduate Internship)

This position focuses to establish a next-generation AI-native semiconductor design framework that enables integrated optimization across the Device–Circuit–Package–System stack. It...

High Performance Logic Devices

Technology Development (TD), Logic

This position focuses on advanced CMOS technology development by investigating low-dimensional (2D/1D) transistors through experiments and TCAD simulations. The research...

Standard Cell Design and Benchmarking for 3D-Stacked FETs

Design and Benchmark (DB), DTCO

This position focuses on evaluating and abstracting the physical characteristics of silicon 3D-stacked FETs and novel-material devices from the standard-cell...

System-Level Benchmarking of Advanced Devices and Packaging Technologies

Design and Benchmark (DB), STCO

This position focuses on system-level benchmarking of advanced devices and packaging technologies. The candidate will work on evaluating the performance,...

Advanced Packaging Technologies

Components and Packaging (CP), Packaging

This position focuses on integrated electrical, mechanical, and thermal design, experimentation, measurement, and development for high-speed signal transmission based on...