Invited Talks
2024
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(Invited Talk) Direct-printing more components onto large-area and 3D electronics
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(Invited Talk) Heterogeneous integration technology development: monolithic 3D integration and advanced packaging
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(Invited Talk) Additively manufactured packaging substrates for fan-out interposers
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(Tutorial) Advanced packaging and new opportunities for additive manufacturing
2023
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(Invited Talk) 단일3차원집적, 이종집적을 위한 반도체소자·패키지 제작
International Conferences
2026
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Analysis of shrinkage-induced dimensional mismatch in 3D-printed packaging substrates for flip-chip bonding
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Vertical-die (v-die) 3.5D integration for cool ultrahigh-bandwidth memory systems
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Microchannel-embedded 3D-printed ceramic substrates for liquid-cooled power module packaging
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3D-printed coaxial-fed patch-antenna-embedded substrates for 5G antenna-in-package applications
2025
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Sulfur vacancy repair in MoS2 using electron-withdrawing benzenethiol
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Radio-frequency signal transmission in organic mixed ionic-electronic conductors
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3D-printed organic interposer with embedded fan-out interconnects enabled by additive manufacturing
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Development of silver EHD jet printing design rules for reliable RF component fabrication
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Radio-frequency carbon nanotube field-effect transistors on glass substrates
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Continuous-time linear equalization based on organic mixed ionic-electronic conductors
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Reinforcement learning-driven custom liquid micro-channel design for direct liquid cooling in advanced packaging
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Advanced interconnect design in 3D-printed fan-out interposers
2024
2022
Domestic Conferences
2026
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Robust CPW-coaxial transition structures for 3D-printed AiP substrate embedding RF components
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High-resolution ceramic 3D printing using multidose strategies for liquid cooled flip-chip power packaging
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Adaptive RF signal control using mixed ionic-electronic devices for antenna tuning and channel equalization
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Electrohydrodynamic jet-printed coplanar waveguide transmission lines for UCIe-based high-speed heterogeneous systems
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Automated optical detection and thickness estimation of 2D flakes for large-scale FET data acquisition
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Effect of seed-layer morphology on dielectric and device performance in MoS2 field-effect transistors
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Study of substrate-dependent signal integrity in chiplet systems
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Optimized FlipFET standard cell design for reduced gate delay and improved routability
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3D-printed 28-GHz antenna-in-package lid substrate featuring 50-ohm quasi-coaxial through-vias
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Buried electrostatic doping using nonstoichiometric silicon nitride for scaled n-type MOSFET-like CNFETs enabling high on/off ratio
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T-shaped gate high frequency carbon nanotube field-effect transistors on glass substrates
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Understanding the interfaces in dimension-limited self-alignment for highly ordered carbon nanotube monolayers
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Design rule development of electrohydrodynamic jet printing for UCIe based high-speed interconnections
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Scaling characteristics of oxide-based vertical channel transistors for gain-cell memory
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Fan-out 3D-printed packages with embedded curved through-hole interconnections
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Mixed ionic-electronic conductors-based radio-frequency switches with interdigitated channel
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3D-printed AiP lid substrates with coaxial through-via feeds for improved high-frequency signal integrity
2025
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High-speed mixed ionic-electronic active devices for bio- and RF signal processing
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균일한 Cu pillar 범프 형성을 위한 잉크젯 프린팅 포토레지스트 도포 공정 개발
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강화학습을 통한 첨단 반도체 패키징에서의 냉각 채널 최적 설계
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마이크로스트립 구조를 이용한 유리 기판의 복소 유전율 측정
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고정밀 마이크로 스케일 RF 부품 제작에서 전기 수력학 프린팅 기술의 디자인 룰 개발
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첨단 반도체 패키징을 위한 3D 프린팅 유기 팬아웃 기판
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Fabrication of quasi-coaxial through-hole embedded substrate for antenna-in-package using 3D printing
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Curved through-holes in 3D-printed fanout organic interposer substrate
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Fabrication of RF transmission lines and antenna using EHD inkjet printing
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3D-printed quasi-coaxial through-hole embedded substrate for antenna-in-package applications
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Novel through-hole interconnect technologies for 3D printed fanout interposer substrates
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3D-printed antenna-in-package substrates with quasi-coaxial through-vias for 5G-advanced applications
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Inkjet-printed photoresist films for panel-level packaging using glass interposers
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Atomic layer deposition for high-mobility and reliable ITZO thin film transistors
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Top-gate carbon nanotubes field-effect transistors with buried extension gates for electrostatic doping
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Bundle-free aligned semiconductor carbon nanotubes for field-effect transistors
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Achieving low leakage current in carbon nanotube field-effect transistors using an extension doping layer
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Top-gate oxide semiconductor FETs for reliable 2T0C read/write operation with reduced capacitive coupling
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Interlayer dielectric engineering in vertical-channel ITO field-effect transistors for bias-reliable operation
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3D-printed organic substrates for low-cost, re-distribution-layer-less fanout interposers
2024
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게이트 절연막 시드층 최적화를 통한 상부 게이트 MoS2 전계효과트랜지스터 제작
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정렬 탄소나노튜브 채널 전계효과트랜지스터를 위한 탄소나노튜브 번들 제거 공정
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패널패키징을 위한 잉크젯 포토레지스트 Cu Bump 공정 개발