International Conferences

2026

  1. [027] Analysis of shrinkage-induced dimensional mismatch in 3D-printed packaging substrates for flip-chip bonding
    Haksoon Jung, Yurim Choi, Kyungsun Kim, Nahyeon Kim, Jimin Kwon*
    2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026)
  2. [026] Vertical-die (v-die) 3.5D integration for cool ultrahigh-bandwidth memory systems
    Heesoo Yang† (Presenter), Hyeongjun Kim†, Yurim Choi, Seungmin Lee, Dongyun Kam, Haksoon Jung, Yongwoo Lee, Seongju Kim, Jimin Kwon*
    2026 IEEE Symposium on VLSI Technology and Circuits (VLSI)
  3. [025] Microchannel-embedded 3D-printed ceramic substrates for liquid-cooled power module packaging
    Haksoon Jung (Presenter), Seongju Kim, Nahyeon Kim, Seungjun Chung, Jimin Kwon*
    2026 76th IEEE Electronic Components and Technology Conference (ECTC)
  4. [024] 3D-printed coaxial-fed patch-antenna-embedded substrates for 5G antenna-in-package applications
    Kyungsun Kim (Presenter), Haksoon Jung*, Nahyeon Kim, Yongwoo Lee, Yunsik Park, Jimin Kwon*
    2026 76th IEEE Electronic Components and Technology Conference (ECTC)

2025

  1. [023] Active BSCDN benchmark framework with backside-compatible CNFET logic technology
    Yehyun Shin†, Ikkyum Kim†, Minho Park† (Presenter), Junghyun Yoon, Seunghun Baek, Seongmin Eum, Heesoo Yang, Yurim Choi, Jaeyong Jeong, Sanghyeon Kim, Haksoon Jung, Seongju Kim*, Heechun Park*, Jimin Kwon*
    2025 71th IEEE International Electron Devices Meeting (IEDM)
  2. [022] Monolithic 3D integration of III-V HEMTs on glass using ultra-thin dielectric bonding layer: a high-frequency and low-loss active glass platform for sub-thz applications
    Jaeyong Jeong†, Yurim Choi†, Seongju Kim, Hyeongjun Kim, Jimin Kwon*, Sanghyeon Kim*
    2025 71th IEEE International Electron Devices Meeting (IEDM)
  3. [021] Thermal evaluation and comparison of CAA and GAA indium tin oxide vertical channel transistors
    Young Suh Song†, Jimin Kang†, Hyeonho Gu†, Haotian Su, Yuan-Mau Lee, Shan X. Wang, Jimin Kwon*, H.-S. Philip Wong*, Eric Pop*
    2025 71th IEEE International Electron Devices Meeting (IEDM)
  4. [020] Sulfur vacancy repair in MoS2 using electron-withdrawing benzenethiol
    Haksoon Jung, Mingyu Kim, Yongwoo Lee, Gi Beom Sim, Hyeonho Gu, Sumin Hong, Sanghyun Lee, Jaehyun Lee, Donghyeop Lee, Taoyu Zou, Kibum Kang, Chang Woo Myung, Yong-Young Noh, Jimin Kwon*
    2025 MRS Fall Meeting
  5. [019] Radio-frequency signal transmission in organic mixed ionic-electronic conductors
    Yongwoo Lee, Hyeongjun Kim, Kyungsun Kim, Haksoon Jung, Seongju Kim, Yurim Choi, Sungmin Eum, Jimin Kwon*
    2025 MRS Fall Meeting
  6. [018] 3D-printed organic interposer with embedded fan-out interconnects enabled by additive manufacturing
    정학순, 권지민
    Korean International Semiconductor Conference on Manufacturing Technology 2025 (KISM 2025)
  7. [017] Development of silver EHD jet printing design rules for reliable RF component fabrication
    Hyeongjun Kim, Yongwoo Lee, Seongju Kim, Jimin Kwon
    International Symposium on Microelectronics and Packaging 2025 (ISMP 2025)
  8. [016] Radio-frequency carbon nanotube field-effect transistors on glass substrates
    Sungmin Eum, Yehyun Shin, Seunghun Baek, Yurim Choi, Kyungsun Kim, Haksoon Jung, Yongwoo Lee, Jimin Kwon
    International Symposium on Microelectronics and Packaging 2025 (ISMP 2025)
  9. [015] Continuous-time linear equalization based on organic mixed ionic-electronic conductors
    Yongwoo Lee, Hyeongjun Kim, Yurim Choi, Kyungsun Kim, Haksoon Jung, Sungmin Eum, Seongju Kim, Jimin Kwon*
    International Symposium on Microelectronics and Packaging 2025 (ISMP 2025)
  10. [014] Reinforcement learning-driven custom liquid micro-channel design for direct liquid cooling in advanced packaging
    Seongju Kim, Jimin Kwon*
    International Symposium on Microelectronics and Packaging 2025 (ISMP 2025)
  11. [013] Advanced interconnect design in 3D-printed fan-out interposers
    Haksoon Jung, Jimin Kwon*
    International Symposium on Microelectronics and Packaging 2025 (ISMP 2025)
  12. [012] Quasi-coaxial through-hole integrated additively manufactured antenna-in-package lid substrates
    Nahyeon Kim (Presenter), Haksoon Jung*, Yurim Choi, Hyeongjun Kim, Seongju Kim, Yongwoo Lee, Yunsik Park, Seungyeon Koh, Hyeok Kim, Jimin Kwon*
    2025 75th IEEE Electronic Components and Technology Conference (ECTC)
  13. [011] 3D printed fanout interposer substrates with curved through-holes for rapid prototyping of advanced packaging
    Haksoon Jung (Presenter), Nahyeon Kim, Yurim Choi, Seongju Kim, Hyunjin Park, Yunsik Park, Seungjun Chung, Jiheong Kang, Jimin Kwon*
    2025 75th IEEE Electronic Components and Technology Conference (ECTC)

2024

  1. [010] Future of memory: massive, diverse, tightly integrated with compute ― from device to software
    Shuhan Liu, Robert M. Radway, Xinxin Wang, Jimin Kwon, Caroline Trippel, Philip Livis, Subhasish Mitra, H.-S. Philip Wong
    2024 70th IEEE International Electron Devices Meeting (IEDM)
  2. [009] Micro-3D-printed packaging substrates with embedded through holes for organic interposers
    Nahyeon Kim (Presenter), Haksoon Jung, Yongwoo Lee, Sungmin Eum, Yechan Han, Hyunjin Park, Yunsik Park, Jimin Kwon*
    2024 74th IEEE Electronic Components and Technology Conference (ECTC)

2022

  1. [008] Bias stress stability of ITO transistors and its dependence on dielectric properties
    Lauren Hoang, Alwin Daus, Sumaiya Wahid, Jimin Kwon, Jung-Soo Ko, Shengjun Qin, Mahnaz Islam, Krishna C Saraswat, H-S Philip Wong, Eric Pop*
    2022 Device Research Conference (DRC)
  2. [007] First demonstration of top-gated ITO transistors: effect of channel passivation
    Sumaiya Wahid, Alwin Daus, Jimin Kwon, Shengjun Qin, Jung-Soo Ko, Krishna C Saraswat, H-S Philip Wong, Eric Pop*
    2022 Device Research Conference (DRC)
  3. [006] 8-layer 3D vertical Ru/AlOxNy/TiN RRAM with mega-ohm level LRS for low power and ultrahigh-density memory
    Shengjun Qin, Maryann Tung, Emma Belliveau, Shuhan Liu, Jimin Kwon, Wei-Chen Chen, Zizhen Jiang, S Simon Wong, H-S Philip Wong*
    2022 IEEE Symposium on VLSI Technology and Circuits (VLSI)

2021

  1. [005] The future of hardware technologies for computing: N3XT 3D MOSAIC, illusion scaleup, co-design
    RM Radway, K Sethi, W-C Chen, Jimin Kwon, S Liu, TF Wu, E Beigne, MM Shulaker, H-SP Wong, S Mitra*
    2021 IEEE International Electron Devices Meeting (IEDM)

2020

  1. [004] Printed 2-V dual-gate CNFETs with an enhanced depletion behavior
    Jimin Kwon, Haksoon Jung, Dongseob Ji, Sungjune Jung, Yong-Young Noh*
    2020 Device Research Conference (DRC)

2019

  1. [003] A phase-separated polymer blocking layer for enhancing data retention in flexible printed nonvolatile organic memories
    Woojo Kim, Jimin Kwon, Yongwoo Lee, Sungjune Jung*
    2019 IEEE International Flexible Electronics Technology Conference (IFETC 2019)
  2. [002] Flexible printed top-contact organic thin-film transistors
    Yongwoo Lee, Jimin Kwon, Woojo Kim, Sungjune Jung*
    2019 IEEE International Flexible Electronics Technology Conference (IFETC 2019)
  3. [001] Technology development for direct-printed dual-gate organic TFT circuit fabrication with 3-D integration
    Jimin Kwon, Woojo Kim, Yongwoo Lee, Sungjune Jung*
    2019 IEEE International Flexible Electronics Technology Conference (IFETC)