* Corresponding authors
† The authors equally contributed
Lab member names in bold

Conference Proceedings

2026

  1. [020] Machine learning-based surrogate model of thermal simulation for heat sink design
    Seongju Kim, Jimin Kwon*
    2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026)
  2. [019] Analysis of shrinkage-induced dimensional mismatch in 3D-printed packaging substrates for flip-chip bonding
    Haksoon Jung, Yurim Choi, Kyungsun Kim, Nahyeon Kim, Jimin Kwon*
    2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026)
  3. [018] Vertical-die (v-die) 3.5D integration for cool ultrahigh-bandwidth memory systems
    Heesoo Yang† (Presenter), Hyeongjun Kim†, Yurim Choi, Seungmin Lee, Dongyun Kam, Haksoon Jung, Yongwoo Lee, Seongju Kim, Jimin Kwon*
    2026 IEEE Symposium on VLSI Technology and Circuits (VLSI)
  4. [017] Microchannel-embedded 3D-printed ceramic substrates for liquid-cooled power module packaging
    Haksoon Jung (Presenter), Seongju Kim, Nahyeon Kim, Seungjun Chung, Jimin Kwon*
    2026 76th IEEE Electronic Components and Technology Conference (ECTC)
  5. [016] 3D-printed coaxial-fed patch-antenna-embedded substrates for 5G antenna-in-package applications
    Kyungsun Kim (Presenter), Haksoon Jung*, Nahyeon Kim, Yongwoo Lee, Yunsik Park, Jimin Kwon*
    2026 76th IEEE Electronic Components and Technology Conference (ECTC)

2025

  1. [015] Active BSCDN benchmark framework with backside-compatible CNFET logic technology
    Yehyun Shin†, Ikkyum Kim†, Minho Park† (Presenter), Junghyun Yoon, Seunghun Baek, Seongmin Eum, Heesoo Yang, Yurim Choi, Jaeyong Jeong, Sanghyeon Kim, Haksoon Jung, Seongju Kim*, Heechun Park*, Jimin Kwon*
    2025 71th IEEE International Electron Devices Meeting (IEDM)
  2. [014] Monolithic 3D integration of III-V HEMTs on glass using ultra-thin dielectric bonding layer: a high-frequency and low-loss active glass platform for sub-THz applications
    Jaeyong Jeong†, Yurim Choi†, Seongju Kim, Hyeongjun Kim, Jimin Kwon*, Sanghyeon Kim*
    2025 71th IEEE International Electron Devices Meeting (IEDM)
  3. [013] Thermal evaluation and comparison of CAA and GAA indium tin oxide vertical channel transistors
    Young Suh Song†, Jimin Kang†, Hyeonho Gu†, Haotian Su, Yuan-Mau Lee, Shan X. Wang, Jimin Kwon*, H.-S. Philip Wong*, Eric Pop*
    2025 71th IEEE International Electron Devices Meeting (IEDM)
  4. [012] Quasi-coaxial through-hole integrated additively manufactured antenna-in-package lid substrates
    Nahyeon Kim (Presenter), Haksoon Jung*, Yurim Choi, Hyeongjun Kim, Seongju Kim, Yongwoo Lee, Yunsik Park, Seungyeon Koh, Hyeok Kim, Jimin Kwon*
    2025 75th IEEE Electronic Components and Technology Conference (ECTC)
  5. [011] 3D printed fanout interposer substrates with curved through-holes for rapid prototyping of advanced packaging
    Haksoon Jung (Presenter), Nahyeon Kim, Yurim Choi, Seongju Kim, Hyunjin Park, Yunsik Park, Seungjun Chung, Jiheong Kang, Jimin Kwon*
    2025 75th IEEE Electronic Components and Technology Conference (ECTC)

2024

  1. [010] Future of memory: massive, diverse, tightly integrated with compute ― from device to software
    Shuhan Liu, Robert M. Radway, Xinxin Wang, Jimin Kwon, Caroline Trippel, Philip Livis, Subhasish Mitra, H.-S. Philip Wong
    2024 70th IEEE International Electron Devices Meeting (IEDM)
  2. [009] Micro-3D-printed packaging substrates with embedded through holes for organic interposers
    Nahyeon Kim (Presenter), Haksoon Jung, Yongwoo Lee, Sungmin Eum, Yechan Han, Hyunjin Park, Yunsik Park, Jimin Kwon*
    2024 74th IEEE Electronic Components and Technology Conference (ECTC)

2022

  1. [008] Bias stress stability of ITO transistors and its dependence on dielectric properties
    Lauren Hoang, Alwin Daus, Sumaiya Wahid, Jimin Kwon, Jung-Soo Ko, Shengjun Qin, Mahnaz Islam, Krishna C Saraswat, H-S Philip Wong, Eric Pop*
    2022 Device Research Conference (DRC)
  2. [007] First demonstration of top-gated ITO transistors: effect of channel passivation
    Sumaiya Wahid, Alwin Daus, Jimin Kwon, Shengjun Qin, Jung-Soo Ko, Krishna C Saraswat, H-S Philip Wong, Eric Pop*
    2022 Device Research Conference (DRC)
  3. [006] 8-layer 3D vertical Ru/AlOxNy/TiN RRAM with mega-ohm level LRS for low power and ultrahigh-density memory
    Shengjun Qin, Maryann Tung, Emma Belliveau, Shuhan Liu, Jimin Kwon, Wei-Chen Chen, Zizhen Jiang, S Simon Wong, H-S Philip Wong*
    2022 IEEE Symposium on VLSI Technology and Circuits (VLSI)

2021

  1. [005] The future of hardware technologies for computing: N3XT 3D MOSAIC, illusion scaleup, co-design
    RM Radway, K Sethi, W-C Chen, Jimin Kwon, S Liu, TF Wu, E Beigne, MM Shulaker, H-SP Wong, S Mitra*
    2021 IEEE International Electron Devices Meeting (IEDM)

2020

  1. [004] Printed 2-V dual-gate CNFETs with an enhanced depletion behavior
    Jimin Kwon, Haksoon Jung, Dongseob Ji, Sungjune Jung, Yong-Young Noh*
    2020 Device Research Conference (DRC)

2019

  1. [003] A phase-separated polymer blocking layer for enhancing data retention in flexible printed nonvolatile organic memories
    Woojo Kim, Jimin Kwon, Yongwoo Lee, Sungjune Jung*
    2019 IEEE International Flexible Electronics Technology Conference (IFETC 2019)
  2. [002] Flexible printed top-contact organic thin-film transistors
    Yongwoo Lee, Jimin Kwon, Woojo Kim, Sungjune Jung*
    2019 IEEE International Flexible Electronics Technology Conference (IFETC 2019)
  3. [001] Technology development for direct-printed dual-gate organic TFT circuit fabrication with 3-D integration
    Jimin Kwon, Woojo Kim, Yongwoo Lee, Sungjune Jung*
    2019 IEEE International Flexible Electronics Technology Conference (IFETC)