-
(Invited Talk) Direct-printing more components onto large-area and 3D electronics
Jimin Kwon
The 21th International Symposium on the Physics of Semiconductors and Applications (ISPSA 2024)
-
(Invited Talk) Heterogeneous integration technology development: monolithic 3D integration and advanced packaging
Jimin Kwon
2024 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD 2024)
-
(Invited Talk) Additively manufactured packaging substrates for fan-out interposers
Jimin Kwon
The 21th International SoC Design Conference (ISOCC 2024)
-
(Tutorial) Advanced packaging and new opportunities for additive manufacturing
Jimin Kwon
International Conference On Consumer Electronics Asia 2024 (ICCE-Asia 2024)