What you will do
1.Agent AI-Based Standard Cell Design for 3DIC and Autonomous Semiconductor Measurement System Development Develop AI agent-based automatic standard cell design technology optimized for 3DIC environments, including PPA optimization layout generation. In addition, establish an autonomous semiconductor measurement platform capable of automated measurement setup, data analysis.
2.Agent AI-Based RF Power Amplifier and Impedance Matching Circuit Design for RF Packaging Develop an AI-driven RF circuit design framework for automatic synthesis of RF power amplifiers and impedance matching networks considering package parasitics in RF packaging environments.
3.Neural Compact Model-Based Readout Circuit Design for Vertical Channel DRAM Develop neural compact models incorporating hysteresis, defect dynamics using TCAD and experimental measurement data, and apply them to vertical channel DRAM and gain-cell memory readout circuit design. Design sense amplifiers and low-power read path architectures through SPICE-integrated simulations.
4.Performance Prediction Simulator Development for Multi-Chip (Chiplet) Systems Develop a system-level simulator capable of analyzing interconnect latency, power integrity and improve accuracy for multi-chip systems using AI models.
Who we are looking for
Under graduates in Electrical Engineering, Computer Science Engineering, or Semiconductor Engineering who demonstrate a strong interest in agent AI based semiconductor automation flatform.