* Corresponding authors
† The authors equally contributed
Lab member names in bold

Journal Articles

2026

  1. [052] IC 내장형 유리기판 RF 패키징 기술 동향
    이용우, 음성민, 김경선, 박윤식, 권지민*
    J. Microelectron. Packag. Soc. 33, 22-35 (2026). DOI: 10.6117/kmeps.2026.33.2.022 · accepted
  2. [051] AI 하드웨어를 위한 3D 패키징 고대역폭/대용량 메모리 기술 발전과 연구 동향
    정학순, 권지민*
    J. Microelectron. Packag. Soc. 33, 36-47 (2026). DOI: 10.6117/kmeps.2026.33.2.036 · accepted
  3. [050] Monolithic 3D-integrated all-solid ion-gated carbon nanotube transistors with tunable ionic conductance for multi-timescale reservoir computing
    Haksoon Jung, Hanbin Cho, Yongwoo Lee, Seunghun Baek, Hyeongjun Kim, Yun Goo Ro, Hyunhyub Ko, Joonki Suh, Yong-Young Noh*, Jimin Kwon*
    Advanced Materials (2026). DOI: 10.1002/adma.202523703 · early access
  4. [049] Oxygen-tunnel indium tin oxide vertical channel transistors with enhanced current density and reliability for monolithic 3D compute-in-memory systems
    Hyeonho Gu, Haksoon Jung*, Yongwoo Lee*, Hoichang Jeong, Yanfeng Zhao, Heesoo Yang, Minho Park, Hyeonjin Lee, Seunghun Baek, Minju Song, Junghwan Kim, Youngmin Jo, Hyunjin Park, Munhyeon Kim, Jae-Joon Kim, Kyuho Jason Lee, Byungjo Kim, Jimin Kwon*
    Advanced Functional Materials e31989 (2026). DOI: 10.1002/adfm.202531989 · early access
  5. [048] Wafer-scale uniform non-ferroelectric κ-phase In2Se3 transistors
    Jaeyun Lee†, Yongwoo Lee†, Haksoon Jung, Taoyu Zou, Mingyu Kim, Hyeonho Gu, Hyeonjin Lee, Tae Hyeon Park, David ChangMo Yang, Chang Woo Myung, Ao Liu*, Jimin Kwon*, Yong-Young Noh*
    Nature Communications 17, 5901 (2026). DOI: 10.1038/s41467-026-72553-y
  6. [047] Statistically resolving thickness-dependent electrical characteristics in multilayer-MoS2 transistors
    Sanghyun Lee, Sumin Hong, Minho Park, Seongju Kim, Sanghoon Baek, Seonguk Yang, Chang-Soo Lee, Sang-Hoon Bae, Joonki Suh, Yongwoo Lee*, Haksoon Jung*, Jimin Kwon*
    Advanced Functional Materials 36, e32204 (2026). DOI: 10.1002/adfm.202532204
  7. [046] Advances and future challenges in monolithic 3D integrated logic, power, and optoelectronics technologies for tightly interconnected intelligent systems
    Haksoon Jung†, Joonghoon Choi†, Seunghun Baek, Bong Gyu Shin, Young Jae Song*, Hanggyo Jung, JoHyeon Kim, Jongwook Jeon*, Gyumin Kim, Heechun Park*, Yeonjoo Lee, Jinkyoung Yoo*, Jae-Hyun Lee, Hyungwoo Kim, Kibum Kang*, Jaeyong Jeong, Sang Hyeon Kim*, Joohan Bae, Chang Soo Kim, Won Kwang Yang, Sungjoo Lee, Jiwook Kwon*, Byung-Sung Kim, Jae-Hoon Han*, Hyung-Jun Kim, Hoon Hahn Yoon*, Jimin Kwon*, Young Joon Hong*
    ACS Nano 20, 6407-6445 (2026). DOI: 10.1021/acsnano.5c15601
  8. [045] Indium tin oxide vertical channel transistors for scaled 4F2 2T0C gain cell memory with etched sidewall cleaning
    Hyeonho Gu†, Haksoon Jung†, Minho Park, Hyeonjin Lee, Ae Rim Choi, Il-Kwon Oh, Yanfeng Zhao, Byungjo Kim, Jungsik Kim, Byung Chul Jang, Yongwoo Lee, Jimin Kwon*
    IEEE Electron Device Letters 47, 836-839 (2026). DOI: 10.1109/LED.2026.3661249

2025

  1. [044] Addressing transconductance-bandwidth trade-off by three-dimensional electrolyte-surrounded organic electrochemical transistors
    Yongwoo Lee†, Seong Jun Park†, Jimin Kwon*, Kang-Il Song*, Sungjune Jung*
    Science Advances 11, eady0279 (2025). DOI: 10.1126/sciadv.ady0279
  2. [043] Back-end-of-line-compatible passivation of sulfur vacancies in MoS2 transistors using electron-withdrawing benzenethiol
    Haksoon Jung†, Mingyu Kim†, Yongwoo Lee, Gi Beom Sim, Hyeonho Gu, Sumin Hong, Sanghyun Lee, Jaehyun, Donghyeop Lee, Taoyu Zou, Kibum Kang, Chang Woo Myung, Yong-Young Noh*, Jimin Kwon*
    ACS Nano 19, 6069-6078 (2025). DOI: 10.1021/acsnano.4c12927
  3. [042] 3D active-matrix multimodal sensors arrays for independent detection of pressure and temperature
    Youngmin Jo, Youngoh Lee, Jimin Kwon, Seongju Kim, Gyungin Ryu, Soyoung Yun, Sanghoon Baek*, Hyunhyub Ko*, Sungjune Jung*
    Science Advances 11, eads4516 (2025). DOI: 10.1126/sciadv.ads4516

2024

  1. [041] Design and integration of organic printed thin-film transistor-based soft biosensors for wearable applications
    Sanghoon Baek*, Youngmin Jo, Yongwoo Lee, Jimin Kwon*, Sungjune Jung*
    ACS Applied Electronic Materials 6, 7657-7678 (2024). DOI: 10.1021/acsaelm.4c01632
  2. [040] Ambient printing of native oxides for ultrathin transparent flexible circuit boards
    Minsik Kong†, Man Hou Vong†, Mingyu Kwak, Ighyun Lim, Younghyun Lee, Seong-hun Lee, Insang You, Omar Awartani, Jimin Kwon, Tae Joo Shin, Unyong Jeong*, Michael D Dickey*
    Science 385, 731-737 (2024). DOI: 10.1126/science.adp3299
  3. [039] Dual-gate carbon nanotube thin-film transistors with printed channel and passivation interlayer on plastic foil
    Yongwoo Lee†, Haksoon Jung†, Youngmin Jo, Sanghoon Baek, Hyunjin Park, Seong Jun Park, Sungjune Jung, Yong-Young Noh*, Jimin Kwon*
    IEEE Electron Device Letters 45, 2036-2039 (2024). DOI: 10.1109/LED.2024.3440484
  4. [038] Stabilizing schottky junction in conjugated polymer diodes enables long-term reliable radio-frequency energy harvesting on plastic
    Yongwoo Lee, Boseok Kang, Sungjune Jung*, Jimin Kwon*
    npj Flexible Electronics 8, 41 (2024). DOI: 10.1038/s41528-024-00326-y
  5. [037] High mobility amorphous polymer-based 3D stacked pseudo logic circuits through precision printing
    Woojo Kim, Gyungin Ryu, Youhyun Nam, Hyeonmin Choi, Meng Wang, Jimin Kwon, Christian B Nielsen*, Keehoon Kang*, Sungjune Jung*
    Advanced Functional Materials 34, 2312922 (2024). DOI: 10.1002/adfm.202312922
  6. [036] High energy density in artificial heterostructures through relaxation time modulation
    Sangmoon Han†, Justin S. Kim†, Eugene Park†, Yuan Meng, Zhihao Xu, Alexandre C Foucher, Gwan Yeong Jung, Ilpyo Roh, Sangho Lee, Sun Ok Kim, Ji-Yun Moon, Seung-Il Kim, Sanggeun Bae, Xinyuan Zhang, Bo-In Park, Seunghwan Seo, Yimeng Li, Heechang Shin, Kate Reidy, Anh Tuan Hoang, Suresh Sundaram, Phuong Vuong, Chansoo Kim, Junyi Zhao, Jinyeon Hwang, Chuan Wang, Hyungil Choi, Dong-Hwan Kim, Jimin Kwon, Jin-Hong Park, Abdallah Ougazzaden, Jae-Hyun Lee, Jong-Hyun Ahn, Jeehwan Kim, Rohan Mishra, Hyung-Seok Kim, Frances M Ross*, Sang-Hoon Bae*
    Science 384, 312-317 (2024). DOI: 10.1126/science.adl2835
  7. [035] Flexible field-effect transistors with high-quality and uniform single-layer graphene for high mobility
    Hyunjin Park*, Jimin Kwon, Jihyung Seo, Kiho Kim, Yun Ho Kim, Sungjune Jung*
    Semiconductor Science and Technology 39, 04LT01 (2024). DOI: 10.1088/1361-6641/ad3111

2023

  1. [034] Effect of back-gate dielectric on indium tin oxide (ITO) transistor performance and stability
    Alwin Daus, Lauren Hoang, Carlo Gilardi, Sumaiya Wahid, Jimin Kwon, Shengjun Qin, Jung-Soo Ko, Mahnaz Islam, Aravindh Kumar, Kathryn M Neilson, Krishna C Saraswat, Subhasish Mitra, H-S Philip Wong, Eric Pop*
    IEEE Transactions on Electron Devices 70, 5685-5689 (2023). DOI: 10.1109/TED.2023.3319300
  2. [033] Latent and controllable doping of stimuli-activated molecular dopants for flexible and printable organic thermoelectric generators
    Young-Shin Kim, Hoimin Kim, Taewoong Yoon, Min-Jae Kim, Jiyun Lee, Hansol Lee, Dongki Lee, Young Jae Song, Jimin Kwon, Sae Byeok Jo, Jeong Ho Cho, Seung Goo Lee, Boseok Kang*
    Chemical Engineering Journal 470, 144129 (2023). DOI: 10.1016/j.cej.2023.144129
  3. [032] Effect of top-gate dielectric deposition on the performance of indium tin oxide transistors
    Sumaiya Wahid, Alwin Daus, Jimin Kwon, Shengjun Qin, Jung-Soo Ko, H-S Philip Wong, Eric Pop*
    IEEE Electron Device Letters 44, 951-954 (2023). DOI: 10.1109/LED.2023.3265316
  4. [031] Dual-gate thin film transistor lactate sensors operating in the subthreshold regime
    Sanghoon Baek, Hiroyuki Matsui, Taisei Mano, Ju An Park, Youngmin Jo, Yongwoo Lee, Shizuo Tokito, Jimin Kwon*, Sungjune Jung*
    Biosensors and Bioelectronics 222, 114958 (2023). DOI: 10.1016/j.bios.2022.114958
  5. [030] Large transconductance of electrochemical transistors based on fluorinated donor-acceptor conjugated polymers
    Seongmin Heo†, Jimin Kwon†, Mingi Sung, Seunglok Lee, Yongjoon Cho, Haksoon Jung, Insang You, Changduk Yang*, Junghoon Lee*, Yong-Young Noh*
    ACS Applied Materials & Interfaces 15, 1629-1638 (2023). DOI: 10.1021/acsami.2c16979
  6. [029] 3D integration of flexible and printed electronics: integrated circuits, memories, and sensors
    Woojo Kim, Jimin Kwon*, Sungjune Jung*
    Journal of Flexible and Printed Electronics 2, 199-210 (2023). DOI: 10.56767/jfpe.2023.2.2.199

2022

  1. [028] High performance carbon nanotubes thin film transistors by selective ferric chloride doping
    Noh-Hwal Park, Eun Sol Shin, Gi-Seong Ryu, Jimin Kwon, Dongseob Ji, Hyunjin Park, Yun Ho Kim, Yong-Young Noh*
    Journal of Information Display 24, 109-118 (2022). DOI: 10.1080/15980316.2022.2141362
  2. [027] Spatiotemporal measurement of arterial pulse waves enabled by wearable active-matrix pressure sensor arrays
    Sanghoon Baek†, Youngoh Lee†, JinHyeok Baek, Jimin Kwon, Seongju Kim, Seungjae Lee, Karl-Philipp Strunk, Sebastian Stehlin, Christian Melzer, Sung-Min Park*, Hyunhyub Ko*, Sungjune Jung*
    ACS Nano 16, 368-377 (2022). DOI: 10.1021/acsnano.1c06695

2021

  1. [026] Layout-to-bitmap conversion and design rules for inkjet-printed large-scale integrated circuits
    Jimin Kwon*, Sanghoon Baek, Yongwoo Lee, Shizuo Tokito, Sungjune Jung*
    Langmuir 37, 10692-10701 (2021). DOI: 10.1021/acs.langmuir.1c01296
  2. [025] Dual-pulse photoactivated atomic force microscopy
    Byullee Park, Seunghyun Lee, Jimin Kwon, Woojo Kim, Sungjune Jung*, Chulhong Kim*
    Scientific Reports 11, 17097 (2021). DOI: 10.1038/s41598-021-96646-4
  3. [024] Flexible and printed organic nonvolatile memory transistor with bilayer polymer dielectrics
    Woojo Kim, Jimin Kwon, Yasunori Takeda, Tomohito Sekine, Shizuo Tokito, Sungjune Jung*
    Advanced Materials Technologies 6, 2100141 (2021). DOI: 10.1002/admt.202100141
  4. [023] Programmable a-InGaZnO gate array with laser-induced forward transfer
    Youngmin Jo, Jimin Kwon, Jan-Laurens van der Steen, Auke Jisk Kronemeijer, Sungjune Jung*
    Flexible and Printed Electronics 6, 015014 (2021). DOI: 10.1088/2058-8585/abe653

2020

  1. [022] Stand-alone intrinsically stretchable electronic device platform powered by stretchable rechargeable battery
    Woo-Jin Song, Minsik Kong, Sunghwan Cho, Sangyeop Lee, Jimin Kwon, Hye Bin Son, Jun Hyuk Song, Dong-Gue Lee, Gyujin Song, Sang-Young Lee, Sungjune Jung, Soojin Park, Unyong Jeong*
    Advanced Functional Materials 30, 2003608 (2020). DOI: 10.1002/adfm.202003608
  2. [021] Artificial multimodal receptors based on ion relaxation dynamics
    Insang You, David G. Mackanic, Naoji Matsuhisa, Jiheong Kang, Jimin Kwon, Levent Beker, Jaewan Mun, Wonjeong Suh, Tae Yeong Kim, Jeffrey B.-H. Tok, Zhenan Bao*, Unyong Jeong*
    Science 370, 961-965 (2020). DOI: 10.1126/science.aba5132
  3. [020] A flexible 3D organic preamplifier for a lactate sensor
    Sanghoon Baek†, Jimin Kwon†, Taisei Mano, Shizuo Tokito, Sungjune Jung*
    Macromolecular Bioscience 20, 2000144 (2020). DOI: 10.1002/mabi.202000144
  4. [019] Phase-separated, printed organic thin-film transistor-based nonvolatile memory with enhanced data retention
    Woojo Kim†, Jimin Kwon*†, Yongwoo Lee, Sanghoon Baek, Sungjune Jung*
    Advanced Materials Technologies 5, 2000228 (2020). DOI: 10.1002/admt.202000228 - selected as an inside-back cover
  5. [018] Reliable inkjet contact metallization on printed polymer semiconductors for fabricating staggered TFTs
    Yongwoo Lee†, Jimin Kwon†, Sungyeop Jung, Woojo Kim, Sanghoon Baek, Sungjune Jung*
    Applied Physics Letters 11, 153301 (2020). DOI: 10.1063/1.5142264

2019

  1. [017] Flexible pressure-sensitive contact transistors operating in subthreshold regime
    Sanghoon Baek, Geun Yeol Bae, Jimin Kwon, Kilwon Cho, Sungjune Jung*
    ACS Applied Materials & Interfaces 11, 31111-31118 (2019). DOI: 10.1021/acsami.9b09636
  2. [016] Compact modelling and SPICE simulation for three-dimensional, inkjet-printed organic transistors, inverters and ring oscillators
    Sungyeop Jung*, Jimin Kwon, Shizuo Tokito, Gilles Horowitz, Yvan Bonnassieux, Sungjune Jung*
    Journal of Physics D: Applied Physics 52, 444005 (2019). DOI: 10.1088/1361-6463/ab3716
  3. [015] Static and dynamic response comparison of printed, single- and dual-gate 3-D complementary organic TFT inverters
    Jimin Kwon*, Hiroyuki Matsui, Woojo Kim, Shizuo Tokito*, Sungjune Jung*
    IEEE Electron Device Letters 40, 1277-1280 (2019). DOI: 10.1109/LED.2019.2922296
  4. [014] Bistaggered contact geometry for symmetric dual-gate organic TFTs
    Jimin Kwon†, Sungyeop Jung†, Yun-Hi Kim*, Sungjune Jung*
    IEEE Transactions on Electron Devices 66, 3118-3123 (2019). DOI: 10.1109/TED.2019.2917013
  5. [013] Parylene copolymer gate dielectrics for organic field-effect transistors
    Hyunjin Park, Jimin Kwon, Hyungju Ahn, Sungjune Jung*
    Journal of Materials Chemistry C 7, 6251-6256 (2019). DOI: 10.1039/C8TC06267F
  6. [012] Three-dimensional monolithic integration in flexible printed organic transistors
    Jimin Kwon, Yasunori Takeda, Rei Shiwaku, Shizuo Tokito*, Kilwon Cho*, Sungjune Jung*
    Nature Communications 10, 54 (2019). DOI: 10.1038/s41467-018-07904-5

2018

  1. [011] Fabrication of ultrathin low-voltage-driven printed organic circuits with anodized gate islands
    Jimin Kwon†, Yongwoo Lee†, Youngmin Jo, Sungjune Jung*
    Organic Electronics 62, 77-81 (2018). DOI: 10.1016/j.orgel.2018.07.008
  2. [010] Parylene-based double-layer gate dielectrics for organic field-effect transistors
    Hyunjin Park, Hyungju Ahn, Jimin Kwon, Seongju Kim, Sungjune Jung*
    ACS Applied Materials & Interfaces 10, 37767-37772 (2018). DOI: 10.1021/acsami.8b12663
  3. [009] Pressure/temperature sensing bimodal electronic skin with stimulus discriminability and linear sensitivity
    Geun Yeol Bae, Joong Tark Han, Giwon Lee, Siyoung Lee, Sung Won Kim, Sangsik Park, Jimin Kwon, Sungjune Jung, Kilwon Cho*
    Advanced Materials 30, 1803388 (2018). DOI: 10.1002/adma.201803388
  4. [008] Control of concentration of non-hydrogen-bonded hydroxyl groups in polymer dielectrics for organic field-effect transistors with operational stability
    Hyunjin Park†, Jimin Kwon†, Boseok Kang, Woojo Kim, Yun-Hi Kim, Kilwon Cho, Sungjune Jung*
    ACS Applied Materials & Interfaces 10, 24055-24063 (2018). DOI: 10.1021/acsami.8b06653
  5. [007] Printed 5-V organic operational amplifiers for various signal processing
    Hiroyuki Matsui, Kazuma Hayasaka, Yasunori Takeda, Rei Shiwaku, Jimin Kwon, Shizuo Tokito*
    Scientific Reports 8, 8980 (2018). DOI: 10.1038/s41598-018-27205-7
  6. [006] Freeform micropatterning of living cells into cell culture medium using direct inkjet printing
    Ju An Park, Sejung Yoon, Jimin Kwon, Hesung Now, Young Kwon Kim, Woo-Jong Kim, Joo-Yeon Yoo, Sungjune Jung*
    Scientific Reports 7, 14610 (2018). DOI: 10.1038/s41598-017-14726-w

2017

  1. [005] Low-temperature, solution-processed, 3-D complementary organic FETs on flexible substrate
    Sujeong Kyung, Jimin Kwon, Yun-Hi Kim, Sungjune Jung*
    IEEE Transactions on Electron Devices 64, 1955-1959 (2017). DOI: 10.1109/TED.2017.2659741

2016

  1. [004] Three-dimensional, inkjet-printed organic transistors and integrated circuits with 100% yield, high uniformity, and long-term stability
    Jimin Kwon, Yasunori Takeda, Kenjiro Fukuda, Kilwon Cho, Shizuo Tokito*, Sungjune Jung*
    ACS Nano 10, 10324-10330 (2016). DOI: 10.1021/acsnano.6b06041 - selected as a front cover and highlighted by Science news
  2. [003] Vertically stacked complementary organic field‐effect transistors and logic circuits fabricated by inkjet printing
    Jimin Kwon, Yasunori Takeda, Kenjiro Fukuda, Kilwon Cho, Shizuo Tokito*, Sungjune Jung*
    Advanced Electronic Materials 2, 1600046 (2016). DOI: 10.1002/aelm.201600046 - selected as a front cover
  3. [002] Double-shot inkjet printing for high-conductivity polymer electrode
    Sejeong Yoon, Sunyoung Sohn, Jimin Kwon, Ju An Park, Sungjune Jung*
    Thin Solid Films 607, 55-58 (2016). DOI: 10.1016/j.tsf.2016.03.068
  4. [001] Solution‐processed vertically stacked complementary organic circuits with inkjet‐printed routing
    Jimin Kwon, Sujeong Kyung, Sejung Yoon, Jae‐Joon Kim*, Sungjune Jung*
    Advanced Science 3, 1500439 (2016). DOI: 10.1002/advs.201500439 - selected as an inside-front cover

Conference Proceedings

2026

  1. [020] Machine learning-based surrogate model of thermal simulation for heat sink design
    Seongju Kim, Jimin Kwon*
    2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026)
  2. [019] Analysis of shrinkage-induced dimensional mismatch in 3D-printed packaging substrates for flip-chip bonding
    Haksoon Jung, Yurim Choi, Kyungsun Kim, Nahyeon Kim, Jimin Kwon*
    2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026)
  3. [018] Vertical-die (v-die) 3.5D integration for cool ultrahigh-bandwidth memory systems
    Heesoo Yang† (Presenter), Hyeongjun Kim†, Yurim Choi, Seungmin Lee, Dongyun Kam, Haksoon Jung, Yongwoo Lee, Seongju Kim, Jimin Kwon*
    2026 IEEE Symposium on VLSI Technology and Circuits (VLSI)
  4. [017] Microchannel-embedded 3D-printed ceramic substrates for liquid-cooled power module packaging
    Haksoon Jung (Presenter), Seongju Kim, Nahyeon Kim, Seungjun Chung, Jimin Kwon*
    2026 76th IEEE Electronic Components and Technology Conference (ECTC)
  5. [016] 3D-printed coaxial-fed patch-antenna-embedded substrates for 5G antenna-in-package applications
    Kyungsun Kim (Presenter), Haksoon Jung*, Nahyeon Kim, Yongwoo Lee, Yunsik Park, Jimin Kwon*
    2026 76th IEEE Electronic Components and Technology Conference (ECTC)

2025

  1. [015] Active BSCDN benchmark framework with backside-compatible CNFET logic technology
    Yehyun Shin†, Ikkyum Kim†, Minho Park† (Presenter), Junghyun Yoon, Seunghun Baek, Seongmin Eum, Heesoo Yang, Yurim Choi, Jaeyong Jeong, Sanghyeon Kim, Haksoon Jung, Seongju Kim*, Heechun Park*, Jimin Kwon*
    2025 71th IEEE International Electron Devices Meeting (IEDM)
  2. [014] Monolithic 3D integration of III-V HEMTs on glass using ultra-thin dielectric bonding layer: a high-frequency and low-loss active glass platform for sub-THz applications
    Jaeyong Jeong†, Yurim Choi†, Seongju Kim, Hyeongjun Kim, Jimin Kwon*, Sanghyeon Kim*
    2025 71th IEEE International Electron Devices Meeting (IEDM)
  3. [013] Thermal evaluation and comparison of CAA and GAA indium tin oxide vertical channel transistors
    Young Suh Song†, Jimin Kang†, Hyeonho Gu†, Haotian Su, Yuan-Mau Lee, Shan X. Wang, Jimin Kwon*, H.-S. Philip Wong*, Eric Pop*
    2025 71th IEEE International Electron Devices Meeting (IEDM)
  4. [012] Quasi-coaxial through-hole integrated additively manufactured antenna-in-package lid substrates
    Nahyeon Kim (Presenter), Haksoon Jung*, Yurim Choi, Hyeongjun Kim, Seongju Kim, Yongwoo Lee, Yunsik Park, Seungyeon Koh, Hyeok Kim, Jimin Kwon*
    2025 75th IEEE Electronic Components and Technology Conference (ECTC)
  5. [011] 3D printed fanout interposer substrates with curved through-holes for rapid prototyping of advanced packaging
    Haksoon Jung (Presenter), Nahyeon Kim, Yurim Choi, Seongju Kim, Hyunjin Park, Yunsik Park, Seungjun Chung, Jiheong Kang, Jimin Kwon*
    2025 75th IEEE Electronic Components and Technology Conference (ECTC)

2024

  1. [010] Future of memory: massive, diverse, tightly integrated with compute ― from device to software
    Shuhan Liu, Robert M. Radway, Xinxin Wang, Jimin Kwon, Caroline Trippel, Philip Livis, Subhasish Mitra, H.-S. Philip Wong
    2024 70th IEEE International Electron Devices Meeting (IEDM)
  2. [009] Micro-3D-printed packaging substrates with embedded through holes for organic interposers
    Nahyeon Kim (Presenter), Haksoon Jung, Yongwoo Lee, Sungmin Eum, Yechan Han, Hyunjin Park, Yunsik Park, Jimin Kwon*
    2024 74th IEEE Electronic Components and Technology Conference (ECTC)

2022

  1. [008] Bias stress stability of ITO transistors and its dependence on dielectric properties
    Lauren Hoang, Alwin Daus, Sumaiya Wahid, Jimin Kwon, Jung-Soo Ko, Shengjun Qin, Mahnaz Islam, Krishna C Saraswat, H-S Philip Wong, Eric Pop*
    2022 Device Research Conference (DRC)
  2. [007] First demonstration of top-gated ITO transistors: effect of channel passivation
    Sumaiya Wahid, Alwin Daus, Jimin Kwon, Shengjun Qin, Jung-Soo Ko, Krishna C Saraswat, H-S Philip Wong, Eric Pop*
    2022 Device Research Conference (DRC)
  3. [006] 8-layer 3D vertical Ru/AlOxNy/TiN RRAM with mega-ohm level LRS for low power and ultrahigh-density memory
    Shengjun Qin, Maryann Tung, Emma Belliveau, Shuhan Liu, Jimin Kwon, Wei-Chen Chen, Zizhen Jiang, S Simon Wong, H-S Philip Wong*
    2022 IEEE Symposium on VLSI Technology and Circuits (VLSI)

2021

  1. [005] The future of hardware technologies for computing: N3XT 3D MOSAIC, illusion scaleup, co-design
    RM Radway, K Sethi, W-C Chen, Jimin Kwon, S Liu, TF Wu, E Beigne, MM Shulaker, H-SP Wong, S Mitra*
    2021 IEEE International Electron Devices Meeting (IEDM)

2020

  1. [004] Printed 2-V dual-gate CNFETs with an enhanced depletion behavior
    Jimin Kwon, Haksoon Jung, Dongseob Ji, Sungjune Jung, Yong-Young Noh*
    2020 Device Research Conference (DRC)

2019

  1. [003] A phase-separated polymer blocking layer for enhancing data retention in flexible printed nonvolatile organic memories
    Woojo Kim, Jimin Kwon, Yongwoo Lee, Sungjune Jung*
    2019 IEEE International Flexible Electronics Technology Conference (IFETC 2019)
  2. [002] Flexible printed top-contact organic thin-film transistors
    Yongwoo Lee, Jimin Kwon, Woojo Kim, Sungjune Jung*
    2019 IEEE International Flexible Electronics Technology Conference (IFETC 2019)
  3. [001] Technology development for direct-printed dual-gate organic TFT circuit fabrication with 3-D integration
    Jimin Kwon, Woojo Kim, Yongwoo Lee, Sungjune Jung*
    2019 IEEE International Flexible Electronics Technology Conference (IFETC)

Patents

2026

  1. [056] 수직 다이 패키징 기술 개발
    권지민, 정학순
    출원번호 10-2026-0082967 (가출원) · 출원
  2. [055] 나노 물질 광학 특성 분석을 이용한 반도체 소자 레이아웃 자동 생성 방법 및 장치
    권지민, 이상현, 정학순, 이용우
    출원번호 10-2026-0052953 · 출원
  3. [054] 반도체소자 및 반도체소자의 패터닝방법
    권지민, 정학순
    출원번호 10-2026-0058387 · 출원
  4. [053] 반도체소자 및 반도체소자의 패터닝방법
    권지민, 정학순
    출원번호 10-2026-0058388 · 출원

2025

  1. [052] Stretchable thin film transistor, stretchable panel, and electronic device
    G. H. Lee, …, H. Jung
    출원번호 202510819824.X(CN) · 출원
  2. [051] 게이트 절연층을 포함하는 수직 구조의 트랜지스터 및 그 제조 방법
    권지민, 이현진, 정학순, 박민호, 이용우
    출원번호 2025-183947(JP) · 출원
  3. [050] 인공 지능 모델에 기반한 반도체 구조물의 방열 구조를 최적화하기 위한 전자 장치, 및 그 동작 방법
    권지민, 정학순, 김성주
    출원번호 2025-187821(JP) · 출원
  4. [049] Apparatus for customized semiconductor packaging, server, system and operation method of the same
    J. Kwon, H. Jung
    출원번호 24216097.6(EU) · 출원
  5. [048] Material for a substrate for electrical connection and substrate for electrical connection between electronic components
    J. Kwon, H. Jung
    출원번호 24218377.0(EU) · 출원
  6. [047] Apparatus for forming interconnect structures inside a substrate formed based on 3D printing, and process method of the same
    J. Kwon, H. Jung
    출원번호 24218381.2(EU) · 출원
  7. [046] Structure combined with a substrate for semiconductor packaging formed based on 3DP, and an electronic device including the same
    J. Kwon, H. Jung
    출원번호 24218382.0(EU) · 중단
  8. [045] Chip-let package including a substrate for semiconductor packaging formed based on 3DP, and an electronic device including the same
    J. Kwon, H. Jung
    출원번호 24218385.3(EU) · 출원
  9. [044] Antenna package including a substrate for semiconductor packaging formed based on 3DP, and an electronic device including the same
    J. Kwon, H. Jung
    출원번호 24218387.9(EU) · 중단
  10. [043] Vertical transistor including gate insulating layer and manufacturing method thereof
    J. Kwon, H. Lee, H. Jung, M. Park, Y. Lee
    출원번호 25212389.8(EU) · 출원
  11. [042] Electronic device for optimizing heat dissipation structure of semiconductor structure based on artificial intelligence model, and operating method thereof
    J. Kwon, H. Jung, S. Kim
    출원번호 25213729.4(EU) · 출원
  12. [041] Apparatus for customized semiconductor packaging, server, system and operation method of the same
    J. Kwon, H. Jung
    출원번호 18/964696(US) · 출원
  13. [040] Material for producing a semiconductor packaging structure based on 3D printing
    J. Kwon, H. Jung
    출원번호 18/976375(US) · 출원
  14. [039] Apparatus for forming interconnect structures inside a substrate formed based on 3D printing, and process method of the same
    J. Kwon, H. Jung
    출원번호 18/976376(US) · 출원
  15. [038] Structure combined with a substrate for semiconductor packaging formed based on 3DP, and an electronic device including the same
    J. Kwon, H. Jung
    출원번호 18/976377(US) · 중단
  16. [037] Chip-let package including a substrate for semiconductor packaging formed based on 3DP, and an electronic device including the same
    J. Kwon, H. Jung
    출원번호 18/976379(US) · 출원
  17. [036] Antenna package including a substrate for semiconductor packaging formed based on 3DP, and an electronic device including the same
    J. Kwon, H. Jung
    출원번호 18/976381(US) · 중단
  18. [035] Stretchable thin film transistor, stretchable panel, and electronic device
    G. H. Lee, …, H. Jung
    출원번호 19/237,774(US) · 출원
  19. [034] Vertical transistor including gate insulating layer and manufacturing method thereof
    J. Kwon, H. Lee, H. Jung, M. Park, Y. Lee
    출원번호 19/375,205(US) · 출원
  20. [033] Electronic device for optimizing heat dissipation structure of semiconductor structure based on artificial intelligence model, and operating method thereof
    J. Kwon, H. Jung, S. Kim
    출원번호 19/379,913(US) · 출원
  21. [032] 수직채널 반도체 소자 및 그 제조 방법
    권지민, 구현호, 박민호, 이용우
    출원번호 10-2025-0002761 · 출원
  22. [031] 게이트 절연층을 포함하는 수직 구조의 트랜지스터 및 그 제조 방법
    권지민, 이현진, 정학순, 박민호, 이용우
    출원번호 10-2025-0002764 · 등록번호 10-2925208 · 등록
  23. [030] 이온 게이트 박막 트랜지스터를 포함하는 반사 부재 전자 장치 및 그 동작 방법
    권지민, 이용우, 정학순
    출원번호 10-2025-0005699 · 출원
  24. [029] 이온 박막 트랜지스터에 기반한 RF 신호의 반사 조절을 위한 전자 장치 및 그 동작 방법
    권지민, 이용우, 정학순
    출원번호 10-2025-0005702 · 출원
  25. [028] 3D 프린팅에 기반하여 반도체 패키징 구조물을 제조하기 위한 소재
    권지민, 정학순
    출원번호 10-2025-0071064 · 등록번호 10-2942704 · 등록
  26. [027] 3D 프린팅에 기반하여 고객 맞춤형 반도체 패키징 용 구조물을 제공하는 서버, 및 그 동작 방법
    권지민, 정학순
    출원번호 10-2025-0071066 · 등록번호 10-2957856 · 등록
  27. [026] 3D 프린팅에 기반하여 패턴 형성을 위한 전자 장치, 및 그 동작 방법
    권지민, 정학순
    출원번호 10-2025-0071068 · 등록번호 10-2872881 · 등록
  28. [025] 3D 프린팅에 기반하여 생성된 기판 내부에 인터커넥트 구조를 형성하기 위한 장치, 및 그 제조 방법
    권지민, 정학순
    출원번호 10-2025-0071073 · 등록번호 10-2957860 · 등록
  29. [024] 3D 프린팅에 기반하여 형성된 반도체 패키징을 위한 기판과 결합된 구조물, 및 이를 포함하는 전자 장치
    권지민, 정학순
    출원번호 10-2025-0071074 · 출원
  30. [023] 3D 프린팅에 기반하여 형성된 반도체 패키징을 위한 기판을 포함하는 칩-렛 패키지, 및 이를 포함하는 전자 장치
    권지민, 정학순
    출원번호 10-2025-0071080 · 등록번호 10-2957863 · 등록
  31. [022] 3D 프린팅에 기반하여 형성된 반도체 패키징을 위한 기판을 포함하는 안테나 패키지, 및 이를 포함하는 전자 장치
    권지민, 정학순
    출원번호 10-2025-0071081 · 출원
  32. [021] 3D 프린팅 기반 반도체 패키징을 위한 설계 기능을 제공하는 서버, 및 그 동작 방법
    권지민, 정학순
    출원번호 10-2025-0071085 · 등록번호 10-2942713 · 등록
  33. [020] 도면 파일에 기반하여 반도체 패키징 용 구조물을 생성하기 위한 인쇄 파일을 생성하기 위한 서버, 및 그 동작 방법
    권지민, 정학순
    출원번호 10-2025-0071086 · 출원
  34. [019] 인공 지능 모델에 기반한 반도체 구조물의 방열 구조를 최적화하기 위한 전자 장치, 및 그 동작 방법
    권지민, 정학순, 김성주
    출원번호 10-2025-0162475 · 출원
  35. [018] 칼코젠 결함 회복을 위한 처리제 및 이를 이용한 칼코젠 결함 회복 방법
    권지민, 정학순, 이철호
    출원번호 10-2025-0181227 · 출원
  36. [017] 기상 증착 장치 및 이를 이용한 칼코젠 결함 회복 방법
    권지민, 정학순, 이철호
    출원번호 10-2025-0181247 · 출원
  37. [016] 클록 분배망의 독립적 배선 구조를 이용한 클록 신호 및 로직 신호의 완전 분리형 반도체 장치 및 시스템
    권지민, 박희천, 박민호, 신예현, 김익겸
    출원번호 10-2025-0194458 · 출원

2024

  1. [015] 3D 프린팅 기반 소비자 맞춤형 반도체 패키징을 위한 장치, 서버, 시스템, 및 그 동작 방법
    권지민, 정학순
    출원번호 2024-207709(JP) · 출원
  2. [014] 3D 프린팅에 기반하여 반도체 패키징 구조물을 생성하기 위한 소재
    권지민, 정학순
    출원번호 2024-221471(JP) · 출원
  3. [013] 3D 프린팅에 기반하여 형성된 기판 내부의 인터커넥트 구조를 형성하기 위한 장치, 및 공정 방법
    권지민, 정학순
    출원번호 2024-221476(JP) · 출원
  4. [012] 3DP에 기반하여 형성된 반도체 패키징 용 기판을 포함하는 칩-렛 패키지, 및 이를 포함하는 전자 장치
    권지민, 정학순
    출원번호 2024-221477(JP) · 출원
  5. [011] 3DP에 기반하여 형성된 반도체 패키징 용 기판과 결합되는 구조물, 및 이를 포함하는 전자 장치
    권지민, 정학순
    출원번호 2024-221492(JP) · 출원
  6. [010] 3DP에 기반하여 형성된 반도체 패키징 용 기판을 포함하는 안테나 패키지, 및 이를 포함하는 전자 장치
    권지민, 정학순
    출원번호 2024-221495(JP) · 출원
  7. [009] 연신 박막 트랜지스터, 연신 패널 및 전자 장치
    이계황, 권지민, 노용영, 강현범, 김형준, 김민규, 정학순
    출원번호 10-2024-0080521 · 출원
  8. [008] 고해상도 유기 발광 소자 픽셀 패턴의 제조방법 및 그에 의해 제조된 고해상도 유기 발광 소자 픽셀 패턴
    권지민, 정학순
    출원번호 10-2024-0202220 · 등록번호 10-2907244 · 등록

2023

  1. [007] 3D 프린팅 기반 소비자 맞춤형 반도체 패키징을 위한 장치, 서버, 시스템, 및 그 동작 방법
    권지민, 정학순
    출원번호 10-2023-0170852 · 등록번호 10-2834356 · 등록

2020

  1. [006] DUAL-GATE THIN FILM TRANSISTOR AND LOGIC GATE COMPRISING THE SAME
    S. Jung, S. Jung, J. Kwon
    등록번호 10-2108098 등록
  2. [005] 3D SRAM CORE CELL HAVING VERTICAL STACKING STRUCTURE AND CORE CELL ASSEMBLY COMPRISING THE SAME
    J. Kwon, S. Jung, J.-J. Kim, K. Cho, S. Kyung
    등록번호 108431954 (CN) 등록
  3. [004] 3D SRAM CORE CELL HAVING VERTICAL STACKING STRUCTURE AND CORE CELL ASSEMBLY COMPRISING THE SAME
    J. Kwon, S. Jung, J.-J. Kim, K. Cho, S. Kyung
    등록번호 10692935 (US) 등록

2019

  1. [003] A SENSOR-AMPLIFER UNIT AND METHOD FOR PREPARING THE SAME
    S. Jung, S. Baek, J. Kwon
    등록번호 10-2029963 등록
  2. [002] THIN-FILM TRANSISTOR-BASED PRESSURE SENSOR AND METHOD OF MANUFACTURING SAME
    S. Baek, S. Jung, J. Kwon, G. Bae, K. Cho
    등록번호 10978595 (US) 등록

2018

  1. [001] Logic circuitry using three dimensionally stacked dual-gate thin-film transistors
    S. Jung, J. Kwon
    등록번호 10,403,759 (US) 등록

Invited Talks

2026

  1. Signal integrity challenges and opportunities in high-density chiplet I/O on glass substrates
    Jimin Kwon, Yurim Choi
    2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026)
  2. Ultrahigh-bandwidth, and ultrahigh-capacity memory system using high-cooling-efficiency 3.5D vertical-die packaging
    Jimin Kwon
    한국마이크로전자패키징학회 (KMEPS 2026 정기학술대회)
  3. High-bandwidth interconnects enabled by EHD printing on glass substrates
    Jimin Kwon
    한국유연인쇄전자학회 (KFPE 2026 춘계)

2025

  1. High-speed mixed ionic-electronic active devices for bio- and RF signal processing
    이용우, 정성준, 권지민
    한국유연인쇄전자학회 (KFPE 2025 추계)
  2. (Tutorial) Glass chiplet interposer packaging: from material innovation to system integration
    Jimin Kwon
    대한전자공학회 (IEIE 2025 하계)
  3. Novel through-hole interconnect technologies for 3D printed fanout interposer substrates
    정학순, 김나현, 권지민
    한국유연인쇄전자학회 (KFPE 2025 춘계)

2024

  1. (Invited Talk) Direct-printing more components onto large-area and 3D electronics
    Jimin Kwon
    The 21th International Symposium on the Physics of Semiconductors and Applications (ISPSA 2024)
  2. (Invited Talk) Heterogeneous integration technology development: monolithic 3D integration and advanced packaging
    Jimin Kwon
    2024 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD 2024)
  3. (Invited Talk) Additively manufactured packaging substrates for fan-out interposers
    Jimin Kwon
    The 21th International SoC Design Conference (ISOCC 2024)
  4. (Tutorial) Advanced packaging and new opportunities for additive manufacturing
    Jimin Kwon
    International Conference On Consumer Electronics Asia 2024 (ICCE-Asia 2024)

2023

  1. (Invited Talk) 단일3차원집적, 이종집적을 위한 반도체소자·패키지 제작
    Jimin Kwon
    한국세라믹학회 추계학술대회 (2023 Fall Meeting of the Korean Ceramic Society)