[040] Robust CPW-coaxial transition structures for 3D-printed AiP substrate embedding RF components

[039] High-resolution ceramic 3D printing using multidose strategies for liquid cooled flip-chip power packaging

[038] Adaptive RF signal control using mixed ionic-electronic devices for antenna tuning and channel equalization

[037] Electrohydrodynamic jet-printed coplanar waveguide transmission lines for UCIe-based high-speed heterogeneous systems

[036] Automated optical detection and thickness estimation of 2D flakes for large-scale FET data acquisition

[035] Effect of seed-layer morphology on dielectric and device performance in MoS2 field-effect transistors

[034] Study of substrate-dependent signal integrity in chiplet systems

[033] Optimized FlipFET standard cell design for reduced gate delay and improved routability

[032] 3D-printed 28-GHz antenna-in-package lid substrate featuring 50-ohm quasi-coaxial through-vias

[031] Buried electrostatic doping using nonstoichiometric silicon nitride for scaled n-type MOSFET-like CNFETs enabling high on/off ratio

[030] T-shaped gate high frequency carbon nanotube field-effect transistors on glass substrates

[029] Understanding the interfaces in dimension-limited self-alignment for highly ordered carbon nanotube monolayers

[028] Design rule development of electrohydrodynamic jet printing for UCIe based high-speed interconnections

[027] Scaling characteristics of oxide-based vertical channel transistors for gain-cell memory

[026] Fan-out 3D-printed packages with embedded curved through-hole interconnections

[025] Mixed ionic-electronic conductors-based radio-frequency switches with interdigitated channel

[024] 3D-printed AiP lid substrates with coaxial through-via feeds for improved high-frequency signal integrity

[023] High-speed mixed ionic-electronic active devices for bio- and RF signal processing

[022] 균일한 Cu pillar 범프 형성을 위한 잉크젯 프린팅 포토레지스트 도포 공정 개발

[021] 강화학습을 통한 첨단 반도체 패키징에서의 냉각 채널 최적 설계

[020] 마이크로스트립 구조를 이용한 유리 기판의 복소 유전율 측정

[019] 고정밀 마이크로 스케일 RF 부품 제작에서 전기 수력학 프린팅 기술의 디자인 룰 개발

[018] 첨단 반도체 패키징을 위한 3D 프린팅 유기 팬아웃 기판

[017] Fabrication of quasi-coaxial through-hole embedded substrate for antenna-in-package using 3D printing

[016] Curved through-holes in 3D-printed fanout organic interposer substrate

[015] Fabrication of RF transmission lines and antenna using EHD inkjet printing

[014] 3D-printed quasi-coaxial through-hole embedded substrate for antenna-in-package applications

[013] Novel through-hole interconnect technologies for 3D printed fanout interposer substrates

[012] 3D-printed antenna-in-package substrates with quasi-coaxial through-vias for 5G-advanced applications

[011] Inkjet-printed photoresist films for panel-level packaging using glass interposers

[010] Atomic layer deposition for high-mobility and reliable ITZO thin film transistors

[009] Top-gate carbon nanotubes field-effect transistors with buried extension gates for electrostatic doping

[008] Bundle-free aligned semiconductor carbon nanotubes for field-effect transistors

[007] Achieving low leakage current in carbon nanotube field-effect transistors using an extension doping layer

[006] Top-gate oxide semiconductor FETs for reliable 2T0C read/write operation with reduced capacitive coupling

[005] Interlayer dielectric engineering in vertical-channel ITO field-effect transistors for bias-reliable operation

[004] 3D-printed organic substrates for low-cost, re-distribution-layer-less fanout interposers

[003] 게이트 절연막 시드층 최적화를 통한 상부 게이트 MoS2 전계효과트랜지스터 제작

[002] 정렬 탄소나노튜브 채널 전계효과트랜지스터를 위한 탄소나노튜브 번들 제거 공정

[001] 패널패키징을 위한 잉크젯 포토레지스트 Cu Bump 공정 개발