What you will do
You will:
- Develop and fabricate packaging processes for high-speed interconnect implementation, including plating and bonding techniques
- Perform electromagnetic simulation-based design of RF and high-speed digital signal transmission structures
- Contribute to funded research projects aimed at developing next-generation semiconductor packaging technologies
Who we are looking for
We are looking for candidates who:
- Are undergraduate students or graduates with a background in Electrical Engineering or Mechanical Engineering
- A background in the following coursework would be considered highly relevant:
- Electrical Engineering: coursework in circuit theory, RF engineering, signals and systems, semiconductor devices, or related subjects
- Mechanical Engineering: coursework in thermodynamics, heat transfer, mechanics of materials, structural analysis, solid mechanics, or related subjects
- Have experience as an undergraduate researcher or possess equivalent research experience
- Have hands-on experience with electromagnetic simulation tools such as HFSS or CST, or demonstrate strong motivation to learn and apply these tools
- Are able to commit to long-term research participation and take responsibility for research schedules and milestones
- Demonstrate a high level of accuracy and attention to detail in experimental work and data analysis
- Approach problem-solving in a calm and structured manner, with persistence and a continuous improvement mindset