Invited Talks

2026

  1. Signal integrity challenges and opportunities in high-density chiplet I/O on glass substrates
    Jimin Kwon, Yurim Choi
    2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026)
  2. Ultrahigh-bandwidth, and ultrahigh-capacity memory system using high-cooling-efficiency 3.5D vertical-die packaging
    Jimin Kwon
    한국마이크로전자패키징학회 (KMEPS 2026 정기학술대회)
  3. High-bandwidth interconnects enabled by EHD printing on glass substrates
    Jimin Kwon
    한국유연인쇄전자학회 (KFPE 2026 춘계)

2025

  1. High-speed mixed ionic-electronic active devices for bio- and RF signal processing
    이용우, 정성준, 권지민
    한국유연인쇄전자학회 (KFPE 2025 추계)
  2. (Tutorial) Glass chiplet interposer packaging: from material innovation to system integration
    Jimin Kwon
    대한전자공학회 (IEIE 2025 하계)
  3. Novel through-hole interconnect technologies for 3D printed fanout interposer substrates
    정학순, 김나현, 권지민
    한국유연인쇄전자학회 (KFPE 2025 춘계)

2024

  1. (Invited Talk) Direct-printing more components onto large-area and 3D electronics
    Jimin Kwon
    The 21th International Symposium on the Physics of Semiconductors and Applications (ISPSA 2024)
  2. (Invited Talk) Heterogeneous integration technology development: monolithic 3D integration and advanced packaging
    Jimin Kwon
    2024 Asia-Pacific Workshop on Advanced Semiconductor Devices (AWAD 2024)
  3. (Invited Talk) Additively manufactured packaging substrates for fan-out interposers
    Jimin Kwon
    The 21th International SoC Design Conference (ISOCC 2024)
  4. (Tutorial) Advanced packaging and new opportunities for additive manufacturing
    Jimin Kwon
    International Conference On Consumer Electronics Asia 2024 (ICCE-Asia 2024)

2023

  1. (Invited Talk) 단일3차원집적, 이종집적을 위한 반도체소자·패키지 제작
    Jimin Kwon
    한국세라믹학회 추계학술대회 (2023 Fall Meeting of the Korean Ceramic Society)