Nahyeon Kim

BIO

Ms. Nahyeon Kim was a versatile researcher who brought together 3D printing and RF packaging technologies to develop a new type of Antenna-in-Package (AiP). In particular, she led research on fabricating complex 3D structures that are difficult to realize using conventional processes and developing quasi-coaxial through-holes and through-vias for high-frequency signal transmission in 3D-printed Antenna-in-Package substrates. She developed a broad understanding of the entire research process, from structural design and 3D printing to metallization through electroplating, RF measurement, and analysis. She also carefully examined fabrication errors and process limitations, continuously refining both the design and fabrication processes. In recognition of her research capabilities, she was selected for the National Research Foundation of Korea’s Master’s Research Fellowship program. She also received an On-site Best Poster Award at the Korean Conference on Semiconductors (KCS) 2025 and a Best Presentation Award at the Korean Society of Flexible and Printed Electronics (KFPE) 2025. Furthermore, she presented “Micro-3D-Printed Packaging Substrates with Embedded Through Holes for Organic Interposers” at the 2024 IEEE Electronic Components and Technology Conference (ECTC), one of the world’s leading international conferences in semiconductor packaging. Through this presentation, she introduced the originality and potential of her 3D-printed RF packaging technology to the international research community. These achievements reflect her exceptional research capabilities and perseverance in transforming a novel fabrication concept into a functional high-frequency packaging structure. Looking back on Nahyeon’s journey from when she first joined the lab to who she is today, we are reminded of how much she has grown through countless challenges, thoughtful reflection, and persistent effort. Watching her develop from a student learning an unfamiliar research field step by step into a researcher capable of setting the direction of her work and carrying it through to meaningful results has been a truly valuable experience for everyone in the lab. As Nahyeon prepares for a new beginning, we sincerely support her and hope that, wherever her path may lead, she will continue to shine with the same perseverance and warmth she has always shown.

Career

• KAIST Ph.D. student (Sep 2026 - present)

Education

• MS / Department of Electrical Engineering, UNIST (Jan 2024 - July 2026)
• BS / Department of Electronic Materials Engineering, Kwangwoon University (Mar 2020 – Feb 2024)

Publications in Lab

Conference

1. Micro-3D-printed packaging substrates with embedded through holes for organic interposers
   First author · 2024 74th IEEE Electronic Components and Technology Conference (ECTC)
2. 3D printed fanout interposer substrates with curved through-holes for rapid prototyping of advanced packaging
   Co-author · 2025 75th IEEE Electronic Components and Technology Conference (ECTC)
3. Quasi-coaxial through-hole integrated additively manufactured antenna-in-package lid substrates
   First author · 2025 75th IEEE Electronic Components and Technology Conference (ECTC)
4. 3D-printed coaxial-fed patch-antenna-embedded substrates for 5G antenna-in-package applications
   Co-author · 2026 76th IEEE Electronic Components and Technology Conference (ECTC)
5. Microchannel-embedded 3D-printed ceramic substrates for liquid-cooled power module packaging
   Co-author · 2026 76th IEEE Electronic Components and Technology Conference (ECTC)
6. Analysis of shrinkage-induced dimensional mismatch in 3D-printed packaging substrates for flip-chip bonding
   Co-author · 2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026)