What you will do
You will:
- Develop and fabricate embedded structures for integrating power amplifiers (PAs) within low-loss, low-dielectric glass substrates, including interconnection processes for chip-to-package electrical connections
- Perform electromagnetic simulation-based design and analysis of RF interconnection structures, evaluating insertion loss, impedance matching, and bandwidth for broadband mmWave operation
- Validate simulation results through fabrication and high-frequency measurement, and contribute to developing chip–package co-design strategies for next-generation RF packaging technologies
Who we are looking for
We are looking for candidates who:
- Are undergraduate students or graduates with a background in Electrical Engineering or Mechanical Engineering
- A background in the following coursework would be considered highly relevant:
- Electrical Engineering: coursework in RF engineering, electromagnetics, circuit theory, semiconductor devices, or related subjects
- Mechanical Engineering: coursework in thermodynamics, heat transfer, mechanics of materials, structural analysis, or related subjects
- Have experience as an undergraduate researcher or possess equivalent research experience
- Have hands-on experience with electromagnetic simulation tools such as HFSS or ADS, or demonstrate strong motivation to learn and apply these tools
- Are able to commit to long-term research participation and take responsibility for experimental schedules and research goals
- Demonstrate a high level of accuracy and attention to detail in checking data through repeated fabrication and measurement processes
- Approach problem-solving with a calm and structured mindset, analyzing root causes and persistently refining structures